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Liquitrend QMW43 - Compact device for continuous buildup thickness and conductivity measurement

Liquid Analysis
Physical Medium Properties
Liquitrend QMW43

Compact device for continuous buildup thickness and conductivity measurement

QMW43
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Oversigt over specifikationer

  • Measurement range

    Conductivity:
    0 µS/ cm...100 mS/ cm
    Build-up thickness:
    0 mm…10 mm

  • Process temperature

    -20°C…+100°C
    (-4°F...+212°F)
    +150°C (+302°F) for 1h

  • Process pressure

    Vacuum...25 bar
    (Vacuum...362.5 psi)

  • Measuring method

    Capacitive- conductive

Anvendelsesområde

The Liquitrend QMW43 is developed for the food and beverage industry to help customers to ensure product safety, improve quality and increase the availability of installations. Base your decisions on the unique and reliable measurement of buildup thickness and conductivity via the combination of conductive and capacitive measuring modes.

  • Cleaning optimization, blending homogeneity monitoring and media differentiation of liquids, suspensions, pasty media etc.

  • For the use in storage, mixing and process vessels with or without an agitator, pipes and equipment periphery

  • Process connections: Threads and hygienic connections

  • Sensor design: Flush-mounted, surface roughness Ra<0.76µm

  • Temperature: -20 to +100°C (-4 to +212°F), CIP/SIP to 150°C (302°F) for 1 hour

  • Certificates and declarations: 3A, FDA, EHEDG and EG1935/2005, EN10204- 3.1

Fordele

  • Reliable, repeatable and accurate measurement of buildup thickness and conductivity regardless of media type

  • Conductive as well as capacitive measuring cycles, the device automatically detects the most accurate measuring mode and uses it automatically

  • Verification of cleaning status without the need to open the tank

  • Compact and flush-mounted stainless-steel sensor offers the perfect insight into the conditions in pipelines or tanks at all critical locations

  • Plug and Play - simple commissioning without presettings

  • Hygienic safety by Design and material traceability are a matter of course

  • Integrated digital communication option via IO-Link

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